Pulsed-Heated Hot-Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts and solder. Pulse heated soldering differs from the traditional soldering process in that the reflow of solder is accomplished using a heating element called a thermode which is heated and cooled down for each connection. Pressure is applied during the entire cycle including heating, reflow, and cooling. This technique is most commonly used to connect flexfoils to Printed Circuit Boards.